Low Temperature Co{0}}Ceramic e thuntseng
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Low Temperature Co{0}}Ceramic e thuntseng

Low Temperature Co-Fired Ceramic ke thepa ea ceramic e tsoetseng pele ea elektroniki e hlahisoang ka ceramic green tape casting, conductor circuit printing, multilayer lamination, le single co{1}}e thunya mocheso o ka tlase ho 900 degrees .
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Tlhaloso

Technical Parameters

Kenyelletso ea Sehlahisoa

 

Low Temperature Co-Fired Ceramic ke thepa ea ceramic e tsoetseng pele ea elektroniki e hlahisoang ka ceramic green tape casting, conductor circuit printing, multilayer lamination, le single co{1}}e thunya mocheso o ka tlase ho 900 degrees .

 

Melemo ea Bohlokoa

 

Tahlehelo ea Dielectric e tlase
LTCC e na le tahlehelo e tlase ea dielectric le dielectric, e fokotsa haholo-thetello ea mats'oao a maqhubu a phahameng haholo, le ho ntlafatsa ts'ebetso ea mats'oao.

Matla a Matla a ho Kopanya Multilayer
LTCC e ts'ehetsa ho kengoa ha li-resistor, li-capacitor, li-inductors, le lithapo tse rarahaneng tsa li-conductors, e leng ho nolofalletsang-meetso ea lipotoloho tse tharo.

E babatsehang Thermal Stability
Thepa e na le coefficient e tlase ea katoloso ea mocheso le botsitso bo botle, e e lumellang ho mamella{0}}baesekele ba nako e telele le mocheso o tlase.

 

LTCC vs Lisebelisoa tse ling

 

Thepa

LTCC

HTCC

PCB

Mocheso oa ho Chesa

<900 degree

+1600 likhato

-

Ts'ebetso ea Maqhubu a Phahameng

E kgabane

E ntle

E itekanetseng

Tahlehelo ea Dielectric

Tlase

Mahareng

Phahameng

Thermal Stability

E kgabane

E kgabane

E itekanetseng

Miniaturization

E kgabane

E ntle

Moedi

Embedded Components

Ee

Moedi

Che

Pontšo ea Botšepehi

E kgabane

E ntle

E itekanetseng

 

Litlhaloso tsa Tekheniki

 

Ntho

Boleng bo Tlwaelehileng

Mofuta oa Boitsebiso

LTCC Ceramic

Dielectric Constant (Dk)

5.5–10

Tahlehelo ea Dielectric (tanδ)

0.001–0.003

Thermal Conductivity

3–5 W/m·K

CTE

5.8–7.2 ×10⁻⁶/K

Layer Count

Ho fihla ho 40+ Mekhahlelo

Min. Bophara ba Mola/Sebaka

Ka tlase ho kapa ho lekana le 50 μm / 50 μm

Min. Ka Diameter

E kholo ho feta kapa e lekana le 75 μm

Tšebeliso ea tšepe

Ag / Au / Cu

Flexural Matla

E kholo ho feta kapa e lekana le 230 MPa

Mocheso oa ho sebetsa

-65℃ho isa ho +250 degree

Bokhopo ba Sekaho

Ka tlase ho kapa ho lekana le 0.3 μm

Litekanyo

Tloaelo

 

Litšebeletso tsa Customization

 

Phetoho ea Sisteme ea Material:E ts'ehetsa moralo oa lisebelisoa tse nang le li-constants tse fapaneng tsa dielectric, conductivity ea mocheso, le li-coefficients tsa katoloso ea mocheso.

Mokhoa oa ho etsa Multilayer Structure Customization:E ts'ehetsa nts'etsopele ea lipalo tse fapaneng tsa masela, botenya, le meaho e rarahaneng ea lithapo tsa 3D.

Metallization Solution Customization:E fana ka litsamaiso tsa conductor tse kang Ag, Au, le Cu, hammoho le litharollo tsa kalafo ea holim'a metsi.

Ntlafatso ea Ts'ebetso ea RF:Moralo o kopanetsoeng o ipapisitse le makhetlo a ts'ebetso, litlhoko tsa tahlehelo, le tikoloho ea ts'ebeliso.

Ntlafatso ea OEM/ODM:E ts'ehetsa-ts'ebeletso e le 'ngoe ho tloha ho khetho ea lisebelisoa, moralo oa sebopeho, nts'etsopele ea sampole ho isa tlhahisong ea bongata.

 

Lisebelisoa

 

Puisano ea 5G:E sebelisoa bakeng sa li-antenna tsa setsi, RF front-ends, le millimeter-wave communication modules.

Radar ea Likoloi:E sebedisetsoa 77GHz automotive millimeter-wave radar packaging le li-antenna systems.

GPS Antennas:E sebelisoa bakeng sa ho tsamaea, ho beha maemo, le lisebelisoa tsa puisano tsa sathelaete.

Lisebelisoa tsa IoT:E loketse liteishene tsa puisano tsa waelese tse kopaneng haholo.

Aerospace Electronics:E finyella litlhokahalo tsa-litsamaiso tse tšepahalang tsa maemo a holimo tsa elektroniki tsa aerospace.

Li-Sensors tsa indasteri:E loketse li-automation tsa indasteri le lisebelisoa tse bohlale tsa ho utloa.

 

Netefaletso ea boleng

 

Tlhahlobo ea Raw Material:Teko e matla e etsoa mabapi le bohloeki, boholo ba likaroloana, le thepa ea bohlokoa ea thepa e tala.

Taolo ea Boleng ba Ts'ebetso:Tlhokomelo ea Marang-rang le ho lateloa ha data ho kengoa ts'ebetsong bakeng sa lits'ebetso tsa bohlokoa ho netefatsa botsitso ba ts'ebetso.

Netefatso e Feletseng ea Tšepahalang ea Sehlahisoa:Ts'ebetso ea motlakase, ho palama baesekele e phahameng le e tlase, ho ts'oaroa ha mocheso, X-ray, le tlhahlobo ea ho thibela moea hore e kene ka har'a metsi ho netefatsa ts'ebetso ea nako e telele{1}e tšepahalang ea sehlahisoa.

 

Matla a Khampani

 

20+ Boiphihlelo ba Lilemo tsa Tlhahiso
E thehiloe ka 2003, e sebetsa ka thata ho R&D le ho etsa thepa e ncha e sa sebetseng, e nang le boiphihlelo ba indasteri ea lilemo tse fetang 20.

Bokhoni bo tsitsitseng ba Tlhahiso
E na le-metheo e kholo ea tlhahiso le sistimi e felletseng ea tlhahiso, e ts'ehetsang{1}litheko tse tsitsitseng tsa nako e telele ho tsoa ho bareki ba lefats'e.

Sehlopha sa litsebi tsa R&D
E na le lisebelisoa tsa R&D le bokhoni ba ho ntlafatsa ts'ebetso, e fana ka tharollo e ikhethileng.

Taolo ea Boleng bo thata
E na le lisebelisoa tse tsoetseng pele tsa tlhahlobo, tse laolang ka thata boleng ba sehlahisoa le botsitso ba sehlopha.

Boiphihlelo ba Global Export
Lihlahisoa li romelloa limmarakeng tsa mose ho maoatle, tse nang le litšebeletso tse tsoang linaheng tse ling le bokhoni ba tšehetso ea bareki.

Customized Solutions
E ts'ehetsa tlhophiso ea litlhaloso tsa sehlahisoa, ts'ebetso, le litlhoko tsa ts'ebeliso ho fihlela litlhoko tse fapaneng tsa bareki.

 

LBH

 

P: Phapano ke efe lipakeng tsa LTCC le HTCC?

K: LTCC e na le mocheso o tlase oa sintering, e ka sebelisa lisebelisoa tse phahameng tsa tšepe, 'me e na le ts'ebetso e phahameng-ea maqhubu a holimo.

Q: Ke merero efe ea metallization e tšehetsoeng?

A: Ag, Au, Cu, le litsamaiso tse ling tsa conductor lia fumaneha.

P: O ka fana ka meralo e ikhethileng?

A: Ho tloaeleha ha thepa, palo ea mekhahlelo, sebopeho sa potoloho, le litekanyo li tšehetsoa.

P: O ka fana ka mehlala?

K: lisampole tsa R&D le-tlhahiso e nyane ea batch lia tšehetsoa.

P: Bonyane palo ea odara ke bokae?

A: Ha ho na moeli o tiileng oa MOQ bakeng sa lihlahisoa tse tloaelehileng; e itšetlehile ka litlhaloso tsa sehlahisoa.

P: Ke nako e kae ea ho etella pele sehlahisoa?

A: lisampole hangata li nka libeke tse 3-4, 'me litaelo tse ngata hangata li nka libeke tse 4-6.

P: Ke mantsoe afe a khoebo a tšehetsoeng?

A: EXW, FOB, CIF, DDP, le mekhoa e meng ea khoebo ea machaba e tšehetsoa.

P: U etsa bonnete ba hore batch ba lumellana joang?

K: Re etsa bonnete ba hore lihlahisoa li fumaneha ka mokhoa o tsitsitseng ka taolo e tloaelehileng ea ts'ebetso le{0}}taolo e felletseng ea boleng.

P: Ke liindasteri life tseo lihlahisoa tsa hau li sebelisoang haholo ho tsona?

A: E sebelisoa haholo lipuisanong tsa 5G, lisebelisoa tsa elektroniki tsa likoloi, sebaka sa sefofane, lisebelisoa tsa elektroniki tsa indasteri le lisensara.

P: Na moetsi o tšehetsa merero ea OEM / ODM?

K: Re ts'ehetsa-lits'ebeletso tse ikhethileng ho tloha ho moralo oa R&D ho isa tlhahisong ea lihlahisoa tse ngata.

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